Mitsubishi Materials has developed a Metal Bond cutter that can process high-hardness brittle materials – the metal sintered inserts “KM013†and “KM023†series. The new product can cut high-speed and high-quality electronic components such as portable information devices that are packaged in electronic circuit boards and use hard and brittle materials such as ceramics, glass, crystal, and quartz.
The new product improves the mixing of metal powders and abrasive particles and improves the uniformity of the material. As a result, the stability and dispersibility of the abrasive grains are improved compared to the original metal sintered blade. Thereby, the amount of abrasive grain protrusion on the surface of the metal sintered blade can be increased, and even if the blade thickness is less than 100 μm, the sharpness equivalent to that of the conventional resin blade (product formed of the resin-bonded diamond abrasive grain material) can be achieved.
The new product improves the mixing of metal powders and abrasive particles and improves the uniformity of the material. As a result, the stability and dispersibility of the abrasive grains are improved compared to the original metal sintered blade. Thereby, the amount of abrasive grain protrusion on the surface of the metal sintered blade can be increased, and even if the blade thickness is less than 100 μm, the sharpness equivalent to that of the conventional resin blade (product formed of the resin-bonded diamond abrasive grain material) can be achieved.
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