Slurry, with its superior performance, reliable quality, won the trust of customers, enabling users to obtain the most reasonable polishing process, the best polishing quality and the best efficiency. Products are widely used in automobiles, motorcycles, aviation, engines, compressors, internal combustion engines, textile machinery, aluminum, zinc-aluminum castings, non-ferrous metal castings, stainless steel precision castings. This product can improve the grinding efficiency and reduce the abrasive wear. Protects and lubricates the workpiece, improving the surface finish and brightness of the workpiece. According to the needs of rolling the workpieces of various materials, different grinding fluids are developed for users to choose.
In 1965, the Monsanto company in the United States first proposed a patent for the application of silica sols and gels to the polishing of silicon wafers. Since then, semiconductor slurry has become an important and indispensable auxiliary material in semiconductor manufacturing. The semiconductor wafer polishing process is an edge process that connects the material and the device. It greatly influences the yield of the material and the device, and it also has the dual task of eliminating the contamination of the previously processed surface and controlling the secondary defects and impurities. Under certain polishing equipment conditions, the polishing effect of silicon wafer depends on the polishing agent and its polishing process technology. With the increasing integration of integrated circuits, the corresponding requirements have also been increased. Not only have the diameters increased, the technical requirements have also been correspondingly improved, and new requirements have emerged.
SiO2 polishing liquid is used for silicon wafer polishing, and chemical mechanical polishing (CMP) technology is currently used. There are rough polishing and fine polishing in the polishing process, so there is a difference between the coarse polishing liquid and the fine polishing liquid. It is estimated that during the period from 2005 to 2010, the overall demand for polishing fluid in the semiconductor polishing wafer industry in China will increase at an average annual growth rate of 25%. A total of about 157 tons of SiO2 slurry was used during 2004. There are approximately 126 tons of rough liquids and approximately 31.5 tons of fine liquids.
At present, most of the polishing fluids used in the processing of semiconductor silicon polishing wafers in China are imported. The foreign semiconductor silicon polishing fluid has a relatively high market share, mainly including Rodel & Onden Nalco of the United States, DUPONT of the United States, and FUJIMI of Japan. Although China's polishing fluid industry has now grown to dozens of companies, there are very few companies involved in semiconductor wafer polishing fluid manufacturing and R&D. Whether it is product quality or market share, domestic companies have shown a considerable gap with foreign manufacturers.
In 1965, the Monsanto company in the United States first proposed a patent for the application of silica sols and gels to the polishing of silicon wafers. Since then, semiconductor slurry has become an important and indispensable auxiliary material in semiconductor manufacturing. The semiconductor wafer polishing process is an edge process that connects the material and the device. It greatly influences the yield of the material and the device, and it also has the dual task of eliminating the contamination of the previously processed surface and controlling the secondary defects and impurities. Under certain polishing equipment conditions, the polishing effect of silicon wafer depends on the polishing agent and its polishing process technology. With the increasing integration of integrated circuits, the corresponding requirements have also been increased. Not only have the diameters increased, the technical requirements have also been correspondingly improved, and new requirements have emerged.
SiO2 polishing liquid is used for silicon wafer polishing, and chemical mechanical polishing (CMP) technology is currently used. There are rough polishing and fine polishing in the polishing process, so there is a difference between the coarse polishing liquid and the fine polishing liquid. It is estimated that during the period from 2005 to 2010, the overall demand for polishing fluid in the semiconductor polishing wafer industry in China will increase at an average annual growth rate of 25%. A total of about 157 tons of SiO2 slurry was used during 2004. There are approximately 126 tons of rough liquids and approximately 31.5 tons of fine liquids.
At present, most of the polishing fluids used in the processing of semiconductor silicon polishing wafers in China are imported. The foreign semiconductor silicon polishing fluid has a relatively high market share, mainly including Rodel & Onden Nalco of the United States, DUPONT of the United States, and FUJIMI of Japan. Although China's polishing fluid industry has now grown to dozens of companies, there are very few companies involved in semiconductor wafer polishing fluid manufacturing and R&D. Whether it is product quality or market share, domestic companies have shown a considerable gap with foreign manufacturers.