Copper plating has good ductility, thermal conductivity and electrical conductivity. Its density is 8.99/cm3, its melting point is 1083°C, and its atomic weight is 63.54. Copper has poor chemical stability. It reacts with carbon dioxide or chloride in moist air to form a layer of basic copper carbonate or cupric chloride. When it is subjected to sulfides, brown or black copper sulfide is formed. When the copper is heated, it is coated with copper. Easy to oxidize. Therefore, in most cases, the electrodeposited copper plating layer is not used as a decorative plating on the surface of the component. If necessary, the copper plating layer must be passivated or colored, and then the surface of the copper plating layer must be coated with a transparent organic resin film.
Copper in the electrochemical sequence is located in the column of positive metals, therefore, the copper plating on the zinc alloy, steel and other metal parts is a cathode coating, when the copper plating layer has pores, defects or damage, under the influence of corrosive media The base metal becomes an anode and is eroded. It erodes faster than when it is not plated, so copper cannot be used as a protective coating alone, but it can be used as an intermediate layer for other coatings. In addition, the use of a combination of thick copper and nickel nickel plating to reduce porosity and nickel consumption.
Commonly used copper plating solutions include acid sulfate copper plating, pyrophosphate copper plating, and cyanide copper plating. Due to environmental protection reasons and with the implementation of the decree of the cyanide-containing electroplating process, it is believed that the non-cyanide copper plating process will be obtained. Rapid development.
Copper in the electrochemical sequence is located in the column of positive metals, therefore, the copper plating on the zinc alloy, steel and other metal parts is a cathode coating, when the copper plating layer has pores, defects or damage, under the influence of corrosive media The base metal becomes an anode and is eroded. It erodes faster than when it is not plated, so copper cannot be used as a protective coating alone, but it can be used as an intermediate layer for other coatings. In addition, the use of a combination of thick copper and nickel nickel plating to reduce porosity and nickel consumption.
Commonly used copper plating solutions include acid sulfate copper plating, pyrophosphate copper plating, and cyanide copper plating. Due to environmental protection reasons and with the implementation of the decree of the cyanide-containing electroplating process, it is believed that the non-cyanide copper plating process will be obtained. Rapid development.