With its superior performance and reliable quality, the polishing liquid has won the trust of the majority of users, enabling users to obtain the most reasonable polishing process, the best polishing quality and the best efficiency. Products are widely used in automobiles, motorcycles, aviation, engines, compressors, internal combustion engines, textile machinery, aluminum profiles, zinc-aluminum castings, non-ferrous metal castings, stainless steel precision castings. This product can improve grinding efficiency and reduce wear of abrasive tools. It protects and lubricates the workpiece and improves the surface finish and brightness of the workpiece. According to the needs of various materials for workpiece roll throwing, different grinding fluids are developed for the user to choose.
In 1965, Monsanto Company of the United States first proposed a patent for the polishing process of silica sol and gel applied to silicon wafers. Since then, the slurry for semiconductors has become an important and indispensable auxiliary material in semiconductor manufacturing. The semiconductor wafer polishing process is an edge process for bonding materials and device fabrication, which greatly affects the yield of materials and devices, and shoulders the dual task of eliminating pre-processed surface damage and controlling secondary defects and impurities. Under certain polishing equipment conditions, the wafer polishing effect depends on the polishing agent and its polishing process technology. As the integration of integrated circuits continues to increase, the corresponding requirements have also increased, not only the diameter has to be increased, the technical requirements have increased accordingly, and new requirements have emerged.
Silicon wafer polishing is performed using SiO2 polishing solution, and chemical mechanical polishing (CMP) technology is currently used. There are rough polishing and fine polishing in the polishing process, so there are varieties of coarse polishing liquid and fine polishing liquid. It is estimated that during the period from 2005 to 2010, the overall demand for polishing liquid in the semiconductor polishing sheet industry in China will increase by an average rate of 25% per year. The total amount of SiO2 polishing solution used in 2004 was about 157 tons. Among them, the crude polishing liquid has about 126 tons, and the fine polishing liquid has about 31.5 tons.
At present, in the processing of semiconductor silicon polishing wafers in China, most of the polishing liquids used are imported. Foreign semiconductor silicon polishing liquids have higher market share, mainly including Rodel & OndenNalco in the US, DUPONT in the US, and FUJIMI in Japan. Although China has developed into dozens of companies in the polishing fluid industry, there are few companies that are involved in the manufacture and research and development of semiconductor wafer polishing fluids. Regardless of product quality or market share, domestic companies have shown a considerable gap with foreign manufacturers.
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